- Description:
- The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic, and photonics components, devices, and systems.
- ISSN:
- 1043-7398
- Website:
- http://electronicpackaging.asmedigitalcollection.asme.org/journal.aspx
- Publisher:
- American Society of Mechanical Engineers
- Frequency:
- Quarterly
- Journal discipline:
- Engineering
- Subject area:
- Engineering and Technology